DFMA Services

Design for manufacturing and Assembly

DFMA is an important part of concurrent engineering, a multidisciplinary approach to product development, in today’s environment. Engineering and manufacturing time is extremely expensive, as are engineering time and manufacturing equipment. PCB materials and components are extremely expensive. It’s critical to design circuit boards that can be made quickly and accurately without incurring additional costs due to assembly rework and mistakes. Design for Manufacturing and Assembly (DFMA) is a design technique that prioritizes ease of manufacture and assembly efficiency while keeping total production costs and time-to-market in mind.

During the early design phases of the product lifecycle, E- Slate’s experienced DFMA team considers and prioritizes both the design’s simplicity of manufacture and the streamlined assembly process of those parts used in the design. Before going into production, we detect any potential manufacturing concerns. Not only identifying where the PCB design surpasses the manufacturing capability of the supplier, but also pointing out where low yield or field failures may occur. This aids in the optimization of designs for manufacturing during the early stages, speeding up the ramp-to-volume cycle.

How well does kbpcba perform in the DFMA?

Our Capabilities :

  • Fiducial Analysis.
  • Component Analysis.
  • Padstack Analysis.
  • Pin to Pad Analysis.
  • Test Point Analysis.
  • Solder Paste Analysis.
  • Netlist analyzer (net Short/Open).
  • Bare bard checks.
  • Silkscreen analysis.
  • BOM Analysis

MPI:

Electronic designs and instruction papers for the plant floor are created. We make it easier to generate high-quality, consistent surface mount technology (SMT) process collateral, allowing you to meet engineering criteria more quickly and reduce machine work before a program is completed.

SMT programming:

SMT(surface mount technology)component placement systems, commonly called pick-and-place machines or P&Ps, are robotic machines which are used to place surface-mount devices (SMDs) onto a printed circuit board (PCB). Our skilled SMT programmer can help you build the programs that can run through the line without any hassle for high speed, high precision placing of a broad range of electronic components.

For You, We Have Analysis Plans!

Component Analysis:
  • Comp Height on primary and secondary side.

  • Component pitch & Length.

  • Assembled Board Thickness.

  • Component Spacing.

    Component under component.

  • Other Side Area and Pin Keepout (Spacing).

  • SMT Component to Conveyed Edge (Primary & Secondary).

  • Silkscreen check.

Padstack analysis:
  • Toeprint (pad) to Toeprint (pad) spacing.

  • Extra Solder Mask Web.

  • No Solder Mask Web. Via to Via Edge.

  • Via to Other Net Toeprint / Pad.

  • Exposed Via to Exposed Toeprint / Pad.

  • Via to Other Net Exposed Toeprint (Exposure).

  • Via in SMD / Via in Pad. Shadowed THMT Toeprint.

  • Silkscreen check.

Pin to Pad analysis:
  • Pin Width / Pad Width. Pin Length / Pad Length.Pin Width / Pad Width.

  • Pin Length / Pad Length.

    Left Distance vs. Right Distance.

  • Pin Diameter vs. Pad Diameter.

  • Pin Pitch / Pad Pitch.

    Edge to edge (annular ring)No Clearance in Plane.

  • Direct Connection to Plane. Rotated Component.

  • CAD/VPL pin count mismatch.

Fiducial Analysis:
  • Number of Global fiducial on primary & secondary side.

Test point analysis:
  • Toeprint and Via Test Points.

  • Nets Without Test Point.

  • est Point Wrong Shape.

  • Test Point to Test Point spacing.

  • Test Point to Toe Print.

  • Test Point to Exposed Copper.

  • Test Point to PTH & NPTH toeprint.

Solder paste analysis:
  • Solderpaste not on SMD.

  • SP outside copper.

  • SP to Rout..

kbpcba performs following checks for DFF

  • Drill checks
  • Signal layer Checks ( outer & inner layers )
  • Power Ground Checks (outer & inner layers )
  • Solder Mask Checks
  • Silk Screen Checks
  • Profile Checks
  • Drills Summary
  • SMD Summary