With the evolution of automotive electrification, BCD technology is becoming increasingly crucial in the field of automotive semiconductors.

With the evolution of automotive electrification, BCD technology is becoming inc

With the evolution of automotive electrification, BCD technology is becoming increasingly crucial in the field of automotive semiconductors. BCD stands for Bipolar - CMOS - DMOS. As the name implies, this technology integrates three types of devices, namely bipolar transistors, complementary metal - oxide - semiconductor (CMOS), and double - diffused metal - oxide - semiconductor (DMOS), on the same chip. By combining the high - drive capability of bipolar transistors, the high - integration and low - power consumption of CMOS, and the high - voltage and high - current characteristics of DMOS, it can reduce the chip area and improve performance. BCD technology was first introduced by STMicroelectronics in 1985. At that time, the process node was 4 microns and the voltage capability was 20V. It was mainly developed to meet the demands for high - performance analog, power management, and high - voltage capabilities in electronic applications. By 2010, the process node had reached 0.11 microns and the voltage capability had been extended to 1200V to meet the requirements of high - voltage applications. Currently, STMicroelectronics has introduced a 90nm BCD technology that integrates eNVM memory and supports 3D stacking technology. In addition, more manufacturers are promoting the development of BCD technology. For example, Chipown's BCD + SOI technology eliminates the latch - up effect through deep - trench isolation, achieving 1200V breakdown voltage and 10MHz high - frequency drive in new - energy inverters, reducing the volume by 60% compared with traditional solutions. During the development of BCD technology, in addition to the incorporation of eNVM, some passive devices have been introduced, including high - precision resistors, capacitors, and inductors, continuously improving the performance of analog circuits. The DMOS structure has also undergone several improvements and iterations to achieve higher current density and lower on - resistance, thereby improving power conversion efficiency.

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Furthermore, SOI technology is being more frequently combined with BCD technology. BCD - SOI improves the anti - interference ability through deep - trench isolation (DTI) and is suitable for high - reliability scenarios. Therefore, considering the integration of high - voltage, high - current, high - degree of sophistication, and high - drive capabilities, BCD technology is particularly well - suited to the needs of automotive electrification. In fact, in traditional fuel - powered vehicles, BCD technology is used in the power drive and signal processing parts of the ECU, supporting functions such as fuel injection and ignition timing, and can handle the high - voltage and high - current requirements for engine operation. In the transmission control unit, BCD technology is used to drive the solenoid valves and actuator chips in the transmission, responsible for managing the shift logic of the automatic transmission and providing high - voltage and high - current support. In electric vehicles, the BMS is one of the cores of the battery system. BCD technology is applied to BMS chips to handle the high - voltage and high - current requirements of the battery pack, monitor, and manage the battery state. The main function of the OBC (on - board charger) is AC - DC conversion, which also requires high - voltage and high - current conversion and control. Power - drive chips, PMICs, etc. on the OBC will use BCD technology. In the future, with the trend of automotive electrification, the BCD process node will be further reduced, enabling support for higher voltages and larger currents to meet the needs of future high - voltage applications. To increase integration, BCD technology will also integrate more functions, such as sensor interfaces, communication modules, and intelligent control units, achieving a higher level of system integration, especially in the fields of automotive electronics and industrial automation. With its high - voltage integration, low - power consumption, and high - reliability, BCD technology has become the core manufacturing technology for automotive chips. With the popularization of new technologies such as 800V high - voltage platforms and intelligent chassis, BCD technology will continue to make breakthroughs in automotive - grade power devices, embedded storage, and multi - domain controllers, promoting the development of automotive electronics towards higher integration and lower costs.

Moreover, as the automotive industry moves towards autonomous driving and connected cars, the demand for high - performance, reliable semiconductors is soaring. BCD technology, with its unique characteristics, is well - positioned to play a vital role in these emerging trends.


In the context of autonomous driving, a large number of sensors are required to perceive the vehicle's surroundings, such as radar, lidar, and cameras. The signal processing circuits for these sensors often demand high - voltage handling capabilities to ensure accurate and stable operation. BCD technology can integrate the necessary power management and signal processing functions on a single chip, reducing the overall system complexity and cost. For instance, in a radar sensor system, BCD - based chips can drive the high - power transmitting modules while also processing the weak received signals with high precision.


Connected cars rely on various communication protocols to exchange data with the outside world, including cellular networks, Wi - Fi, and V2X (Vehicle - to - Everything). The power management and interface circuits for these communication modules need to be highly efficient and reliable. BCD technology's ability to handle different voltage levels and its low - power consumption features make it an ideal choice for powering and controlling these communication - related components.


The development of BCD technology also faces some challenges. One of the key issues is the continuous improvement of process compatibility. As more functions and devices are integrated onto a single chip, ensuring that different components can co - exist and operate stably without interference becomes increasingly difficult. For example, the interaction between the high - voltage DMOS and the low - voltage CMOS circuits may lead to issues such as signal crosstalk and power - supply noise.


Another challenge lies in meeting the ever - stricter requirements for reliability and quality in the automotive industry. Automotive semiconductors need to withstand harsh operating conditions, including extreme temperatures, vibrations, and electromagnetic interference. BCD technology must be further optimized to ensure that chips manufactured using this technology can maintain high - performance operation over a long service life under such adverse conditions.


To address these challenges, research institutions and semiconductor manufacturers are collaborating to develop advanced design techniques and process optimization methods. For example, new isolation technologies are being explored to minimize the interference between different types of devices on the chip. At the same time, more in - depth reliability testing and simulation methods are being developed to predict and improve the long - term performance of BCD - based chips in automotive applications.


In conclusion, BCD technology has firmly established itself as an essential part of the automotive semiconductor ecosystem. As the automotive industry continues to transform towards electrification, autonomy, and connectivity, BCD technology will not only adapt to these changes but also drive innovation, enabling the development of more advanced, efficient, and reliable automotive electronic systems. Its future development will be closely intertwined with the overall progress of the automotive industry, bringing new opportunities and challenges in the years to come.


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